SUPERSTICK #590 HI-MOD GEL

MOISTURE- INSENSITIVE DAMP CURE FORMULATION

DESCRIPTION

E-BOND 590 HI-MOD GEL is a 100% solids, solvent-free, two-component MOISTURE INSENSITIVE epoxy structural adhesivesystem. It has a unique HI-MODULUS OF ELASTICITY. When mixed with salt-free kiln-dried silica aggregate, 590 will produce a sag- resistant mortar for both vertical and overhead patching of interior surfaces. E-Bond 590’s gel-like consistency is an excellent structural adhesive for bonding of mating or non-mating surfaces . 590 Gel is recommended to grout anchor bolts, to seal cracks, and to set injection ports prior to injection grouting.

ADVANTAGES:

• Easy mixing ratio of 1 to 1 for the two components
• Gel-like consistency
• Non-abrasive formula permits application with automated equipment Insensitive to moisture before, during and after cure
• Provides excellent adhesion to most structural materials
• Fast setting; provides high early strength within 24 hours.
• Low Temperature cures as low as 40°F**

E-BOND 590 HI-MOD conforms to ASTM-C-881, Type I and IV, Grade 3, Class B and C, AASHTO-M235-91

PACKAGING: Available in 2 gallon units and 600 ml ratio tube kits (36 in3). Available in larger units on request.

COVERAGE: 1 Gallon of E-Bond #590 HI MOD GEL yields 231 cubic inches of epoxy adhesive. When mixed with 1 gallon of dry loose aggregate, yield will be approximately 350 cubic inches. Each 600ml Tube Kit will cove 40-42 cu. in. *CAUTION:

• Maximum glue line 1⁄8 of an inch when doweling
• Maximum epoxy mortar thickness is 11⁄2 per lift.
• Epoxy mortar is for interior use only.
• Do not thin. Solvents will prevent proper cure.
• Material is a vapor barrier after cure.
• Not for sealing cracks under hydrostatic pressure.
• Minimum age of concrete must be 21-28 days prior
• to application of mortar or sealer on slabs.
• Test for moisture vapor transmission prior to application of mortar or sealing slabs. Moisture passing through the substrate by pressure during application and curing of epoxy can cause bond
• failure.
• Due to many variables in bonding to damp or wet surfaces, be certain to test application under the same conditions as full-scale work.

TEMPERATURES: Will cure at temperatures as low as 40° F., providing the temperature will be 40° F. and rising during the next 72 hours. Epoxy materials and aggregate should be stored at least 24 hours prior to use at 60° F., or higher. Epoxies stored below 60° F., will cause the epoxy to thicken substantially, making it difficult to properly blend the two materials and obtain a proper mating of resin and hardener. Protect from inclement weather and freezing. If product temperature falls below 50° F. it is recommended that a product temperature of 70°F. be obtained prior to using.

Store dry at 40oF – 95oF. Condition to 65oF – 85oF before using.

HOW TO USE SURFACE PREPARATION:

All surfaces must be structurally sound, clean, and free of dirt, dust, oil, grease, or any contaminant that would adversely affect the bond. Surfaces may be dry or damp, but free of standing water.
On new concrete do not use a curing compound. If curing compounds have been used they must be removed. Sandblast or other approved mechanical methods are recommended.

STEEL: Sandblast to white metal finish.

OLD CONCRETE: All loose particles or soft, weak sections must be removed. Asphaltic or oil contaminants should be removed with detergents or other cleaning materials. Surfaces should be thoroughly flushed with plenty of clean water. Surfaces then should be treated with 15% to 20% solution of muriatic acid. Mix the acid with water, approximately 1 part of acid to 3 to 5 parts of water, as required. Follow Safety Precautions when using acids. Pour on the surface in an even manner and thoroughly scrub until bubbling ceases. Thoroughly rinse with plenty of clean water. If chemical means or cleaning does not properly prepare the surface, then other means such as sandblasting, mechanical scarification, and vacuuming should be utilized.

MIXING:

Pre-mix each component separately; place in a clean container 1 part by volume of Component A (Resin) and then add 1 part of Component B (Hardener). Container should have a flat wall and flat bottom.

The importance of thorough mixing/blending cannot be overemphasized. Stir and blend thoroughly. Scrape bottom and sides to make sure both components are blended and mated, usually 21⁄2 to 3 minutes. If you are mixing correctly, bubbles will be whipped into the mixture. Do not be concerned; this is a sign that you are mixing well. A uniform gray product will result. Streaks in the product indicate incorrect mixing. Improper mixing can result in soft or sticky spots.

It is recommended, to eliminate problems of improper mixing, that you use two mixing containers. Mix thoroughly in one container. After you feel it is thoroughly mixed, scrape all the material from one container to the second container. After material has been placed in the second container, thoroughly mix for an additional 1 to 11⁄2 minutes.

With this double type of mixing, any material that might not have been thoroughly mixed from the sides or the bottom of the first container will be easily placed in the center of the mix in the second container and thus will receive thorough mixing at that time. Mix only that quantity that can be used within its working time.

APPLICATION:

For a Structural Adhesive – Apply the neat mixed E-BOND HI-MOD GEL to mating or non-mating prepared substrates. Thoroughly work into the substrate for positive adhesion. Secure the bonded unit firmly into place until the adhesive has cured. Glue line should not exceed 1⁄8 of an inch.

For Interior Applications – To prepare an epoxy mortar add from 1 to 11⁄2 parts by loose volume of 20/30 sieve, salt-free, kiln dried aggregate to 1 volume of the mixed HI-MOD GEL. Mix until uniform in consistency. Amount added may be varied depending on desired consistency. Place the prepared mortar in the void, working the material into the prepared substrate, filling cavities. Strike off level. Do not apply epoxy mortar at thickness greater than 11⁄2 inches per lift.

To Seal Cracks For Injection Grouting – Place the neat material over the cracks to be pressure injected and around each entry port. Allow sufficient time to set before pressure injecting.

To Anchor Bolts, Dowels, and Pins – E-BOND 590 may be used neat, or with larger bolts add approximately 1 to 11⁄2 parts of 20/30 sieve, salt-free, kiln-dried aggregate to 1 volume of mixed E-BOND 590.

This product is recommended to anchor bolts in vertical and horizontal applications.

Due to the non-sag consistency, it is important that a long nozzle be used to force the epoxy to the bottom of the bolt hole to avoid air entrapment. The angular space around the bolt should not exceed 1⁄4 inch. Depth of embedment is normally 15 times the bolt diameter .

Do Not Thin E-BOND 590 HI-MOD GEL — Solvents will prevent proper cure.
Note – For bonding fresh plastic Portland – cement to hardened concrete, use E-BOND 580 HI-MOD.

 

CAUTION – For professional use only; not for sale to or use by the general public. E-Bond’s epoxies contain alkaline amines. Strong sensitizer; MAY CAUSE SKIN SENSITIZATION or allergic response ranging from a mild wheezing to a severe asthmatic type attack. Avoid contact with skin or eyes. IN CASE OF CONTACT immediately wash skin with soap and water. Flush eyes with water and obtain medical attention. Wear protective clothing, goggles, and barrier cream on all exposed skin